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Power and Cooling
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Power and Cooling Improvements
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Although power is an important factor, cooling tends to be the more common barrier listed by users in moving to a blade architecture. Therefore, we will focus on the various approaches, features, and tips for addressing cooling concerns, and will address power issues as they apply.
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Every server, whether tower, rack, or blade, generates heat. More servers generate more heat; fewer servers generate less heat. Consolidation of physical servers reduces the number of physical servers within the data center, which not only reduces the amount of heat generated, and thus the amount of cooling required, but also reduces the floor space required. Consolidating servers can be accomplished in multiple ways. First, for applications that play nicely together on a single operating system, it is possible to consolidate applications that previously have been spread across physical servers, by stacking them together on a single server. Server virtualization goes the next step by consolidating entire servers as virtual servers onto a single physical server. When consolidation and virtualization are implemented together with blades, the reduction in cooling and floor-space requirements can and should be highly beneficial and carefully considered in your data-center planning.
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From the outset, the high density of blade systems created a higher heat output per footprint than rack servers. In addition, as blade systems began to use higher-speed processor chips, the heat (and, thus, the cooling issues) intensified. Fortunately, during this same evolution, a number of other features were introduced at the chip level, the blade and chassis level, and even in related software.
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First and foremost, while blades were taking advantage of higher processor speeds, the chip manufacturers found a number of ways to reduce heat output. The most significant of these has been the move from a single-core chip that fits into a socket on the blade, to a dual-core chip that fits into the same socket. These dual-core chips place two processing engines within the same silicon area but operating at a slightly reduced clock speed. This reduction in speed generates less heat overall, but nearly doubles the processing power. Dual-core
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chips are available from both Intel and AMD, with quad-core chips expected in 2007 from both vendors. (Multicore already exists outside the x86 world with Sun s UltraSPARC). With these advances, multicore chips offer significant improvement in performance per watt, which has become a key metric for evaluating competitive chips. In addition, some chips are now offered in a variety of heat grades, running at different watt levels. This allows users to choose between pure performance and performance per watt. (Intel predicts its Woodcrest processors will reduce thermal power by 40% over single-core designs, and AMD claims 60% faster performance over their single-core chips within the same power envelope.) The other improvement in heat at the chip level comes from the mobile technology that was first used in laptop computers. For quite some time, laptops have had the ability to adjust their processors to enter a low-frequency mode, originally to conserve power while running on battery power. This powermanagement capability has now been extended to other environments such as blades, to allow a server blade to adjust its processor state on demand based on CPU utilization. This allows the CPU to reduce its power at idle (as much as 75%, according to AMD), conserving power and generating significantly less heat.
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Consider power and cooling features carefully when making decisions on chips used in your server blades.
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In addition to the advances at the chip level, blade system vendors have also made great strides in power and cooling. One of the major sources of heat within servers has been due to inefficiencies of power supplies. For example, according to IBM, their 1U rack server power supply operated at 65% efficiency. This means that only 65% of the power that comes from the wall is converted into usable power by the server. The remaining 35% goes into the room in the form of heat. So for every 1 kW from the power provider, 650 W go to the server, and 350 W go into the room as heat. IBM s second generation of blade systems improved their power supplies to run at 91% efficiency, which translates to losing only 90 W as heat into the room. Similar advances in efficiency have come from others, such as HP, helping to make heat within the chassis less of an issue with newer blade server systems. Another area of improvement within the chassis comes from improved airflow within the chassis. One of the primary ways to improve cooling is to eliminate